Xilinx XC2S600E-6FG456I

Teilpunkte

• The XC2S600E-6FG456I chip is a field-programmable gate array (FPGA) manufactured by Xilinx. It has a capacity of 600,000 system gates and 239 user I/Os. It operates at a speed grade of -6 and comes in a 456-pin Fine Grain Ball Grid Array (FBGA) package. The chip offers flexibility and reconfigurability, making it suitable for a variety of applications such as telecommunications, automotive systems, and industrial control.

• Equivalent

  The equivalent products of the XC2S600E-6FG456I chip are XC2S600E-7FG456I, XC2S600E-6FTG256C, and XC2S600E-7FTG256C.

• Features

  The XC2S600E-6FG456I is a Spartan-II FPGA from Xilinx. It features 600,000 system gates, 2,088 logic cells, 32 block RAMs, and 32 DSP slices, providing a flexible solution for various applications. It operates at a speed grade of 6 and comes in a 456-ball fine-pitch BGA package.

• Pinout

  The XC2S600E-6FG456I is an FPGA (Field-Programmable Gate Array) device. It has 456 pins and is capable of implementing various digital logic functions. The specific functions and pin assignments will vary depending on the user's configuration and programming of the FPGA.

• Manufacturer

  The manufacturer of the XC2S600E-6FG456I is Xilinx Inc. It is an American technology company specialized in the design and manufacture of programmable logic devices, including field-programmable gate arrays (FPGAs).

• Application Field

  The XC2S600E-6FG456I is a field-programmable gate array (FPGA) device commonly used in various industrial and telecommunication applications such as high-performance networking, signal processing, and embedded systems. It offers a high logic capacity, multiple I/O options, and efficient power consumption, making it suitable for a wide range of applications.

• Package

  The XC2S600E-6FG456I chip comes in a Fine-Pitch Ball-Grid Array (FG456) package. It is in a 456-pin grid format and has a size of 27 mm x 27 mm.