Xilinx XC3S1000-4FGG320C

Teilpunkte

• The XC3S1000-4FGG320C chip is a field-programmable gate array (FPGA) manufactured by Xilinx. It belongs to the Spartan-3 family and is designed for general-purpose applications. It has 1 million system gates, operates at a speed grade of 4, and comes in a 320-ball grid array (BGA) package. This chip offers programmable logic components and memory blocks, allowing users to configure it according to their specific requirements.

• Equivalent

  Some equivalent products to the XC3S1000-4FGG320C chip are the XC3S1000-4FG320M, XC3S1000-4FT256I, and XC3S1000-4FGG456C chips. These offer similar functionality and features within the same family of Spartan-3 FPGAs from Xilinx.

• Features

  The XC3S1000-4FGG320C is an FPGA (Field-Programmable Gate Array) device with 1000 logic cells, a maximum of 128 I/O pins, and a maximum operating frequency of 320 MHz. It is designed by Xilinx and features a 4-input look-up table (LUT) per logic cell, on-chip RAM, and configurable I/O standards.

• Pinout

  The XC3S1000-4FGG320C is an FPGA (Field Programmable Gate Array) with a pin count of 320. It has a capacity of 1,000 logic cells and operates at a speed grade of -4. Other specific functions and features of this FPGA model can be found in its datasheet provided by the manufacturer.

• Manufacturer

  XC3S1000-4FGG320C is manufactured by Xilinx, Inc. Xilinx is a well-known American technology company specializing in the development and production of programmable logic devices, including field-programmable gate arrays (FPGAs). They provide comprehensive solutions to various industries such as aerospace, automotive, telecommunications, and data centers, enabling their customers to design and deliver innovative electronic products efficiently.

• Application Field

  The XC3S1000-4FGG320C is an FPGA (Field Programmable Gate Array) device that can be used in various application areas such as industrial automation, aerospace and defense, telecommunications, automotive, and medical devices. It provides programmable logic capabilities, allowing for customization and flexibility in implementing complex digital designs.

• Package

  The XC3S1000-4FGG320C chip has a fine pitch ball grid array (FBGA) package type, a 320-ball grid array form, and a size of 17mm x 17mm.