Xilinx XC3S1200E-4FTG256C

Teilpunkte

• The XC3S1200E-4FTG256C chip is a Field Programmable Gate Array (FPGA) device belonging to the Xilinx Spartan-3E family. It offers a range of digital logic and embedded IP cores, making it suitable for various applications like high-performance communications, automotive, and consumer electronics. With 1.2 million system gates and 768 I/O pins, this chip allows for flexible design customization and efficient implementation of complex digital systems.

• Equivalent

  XC3S1200E-4FTG256C is an FPGA chip from Xilinx. Some equivalent products include XC3S1200E-4FGG320C, XC3S1200E-4FG400C, and XC3S1200E-4FGG456C. These chips offer similar functionality and features, but may have different package options.

• Features

  The XC3S1200E-4FTG256C is an FPGA (Field-Programmable Gate Array) with 1.2 million system gates, 23808 logic cells, and 640 user I/O pins. It operates at a maximum frequency of 400 MHz, has 1200 Kbits of block RAM, and supports 49,920 flip-flops. It is manufactured by Xilinx and is widely used for digital logic design and prototyping.

• Pinout

  The XC3S1200E-4FTG256C is a Field-Programmable Gate Array (FPGA) with a pin count of 256. The specific pin functions can be found in the device datasheet provided by the manufacturer.

• Manufacturer

  The manufacturer of the XC3S1200E-4FTG256C is Xilinx. Xilinx is a technology company specializing in the development, production, and sales of field-programmable gate arrays (FPGAs) and related technologies.

• Application Field

  The XC3S1200E-4FTG256C is a field-programmable gate array (FPGA) which can be used in various application areas, including industrial automation, telecommunications, automotive, and consumer electronics. Its high-density logic and abundant I/O make it suitable for complex system designs, signal processing, and control applications.

• Package

  The XC3S1200E-4FTG256C chip comes in a 256-pin Fine Pitch Ball Grid Array (FBGA) package. Its form factor is a flat, square shape with pins arranged in a grid pattern underneath the chip. The size of the package is approximately 17mm x 17mm.