Xilinx XC2S100E-6FT256I

Teilpunkte

• The XC2S100E-6FT256I chip is a field-programmable gate array (FPGA) produced by Xilinx. It offers 1.5 million system gates, 97,200 flip-flops, and 4,608 slices. With these features, the chip enables the implementation of complex digital systems with high performance and flexibility. It is commonly used in various applications, including telecommunications, automotive, industrial automation, and consumer electronics.

• Equivalent

  Some equivalent products of the XC2S100E-6FT256I chip include XC2S200E-6FT256I, XC2S150E-6FGG456C, XC2S150E-6FTG256I, and XC2S200E-6FTG256C.

• Features

  The XC2S100E-6FT256I is a field-programmable gate array (FPGA) with 100,000 system gates, 2160 logic cells, and up to 136 I/O pins. It operates at a maximum frequency of 191 MHz and has 256 pins in a fine-pitch BGA package with a 1.0mm ball pitch. It features enhanced System Monitor functionality and is ideal for low-power applications.

• Pinout

  The XC2S100E-6FT256I is a Field-Programmable Gate Array (FPGA) with a pin count of 256. It is an enhanced version of the XC2S100E-6PQG208C. It features 100,000 system gates and 384 macro cells. It is RoHS compliant and operates at a maximum speed of 381 MHz.

• Manufacturer

  The manufacturer of the XC2S100E-6FT256I is Xilinx Inc. Xilinx is a semiconductor and software design company that specializes in field-programmable gate arrays (FPGAs).

• Application Field

  The XC2S100E-6FT256I is a field-programmable gate array (FPGA) chip. It is widely used in various application areas such as telecommunications, automotive, aerospace, industrial automation, consumer electronics, and medical devices. Its versatility and flexibility make it suitable for a range of purposes, including data processing, signal processing, system control, and more.

• Package

  The XC2S100E-6FT256I chip is in a package type known as "FTBGA" (Fine-Pitch Ball Grid Array), has a 256-ball grid array form, and has a size of 17 x 17 mm.