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ON FDG8850NZ
Mosfet Array 30V 750mA 300mW Surface Mount SC-88 (SC-70-6)
Marken: ON Semiconductor, LLC
Herstellerteil #: FDG8850NZ
Datenblatt: FDG8850NZ Datasheet (PDF)
Paket/Gehäuse: SC-70-6
Produktart: Transistoren
RoHS-Status:
Lagerzustand: 3148 Stück, Neues Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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BOMFDG8850NZ Allgemeine Beschreibung
This dual N-Channel logic level enhancement mode field effect transistors are produced using a proprietary, high cell density, DMOS technology. This very high density process is especially tailored to minimize on-state resistance. This device has been designed especially for low voltage applications as a replacement for bipolar digital transistors and small signal MOSFETs. Since bias resistors are not required, this dual digital FET can replace several different digital transistors, with different bias resistor values.
Funktionen
- Max rDS(on) = 0.4Ω at VGS = 4.5V, ID = 0.75A
- Max rDS(on) = 0.5Ω at VGS = 2.7V, ID = 0.67A
- Very low level gate drive requirements allowing operationin 3V circuits(VGS(th) <1.5V)
- Very small package outline SC70-6
- RoHS Compliant
Anwendung
- This product is general usage and suitable for many different applications.
Spezifikationen
| Parameter | Wert | Parameter | Wert |
|---|---|---|---|
| Source Content uid | FDG8850NZ | Pbfree Code | Yes |
| Part Life Cycle Code | Active | Ihs Manufacturer | ONSEMI |
| Package Description | ROHS COMPLIANT, SC-70, 6 PIN | Manufacturer Package Code | 419AD |
| Reach Compliance Code | compliant | ECCN Code | EAR99 |
| Factory Lead Time | 73 Weeks | Samacsys Manufacturer | onsemi |
| Configuration | SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE | DS Breakdown Voltage-Min | 30 V |
| Drain Current-Max (ID) | 0.75 A | Drain-source On Resistance-Max | 0.4 Ω |
| FET Technology | METAL-OXIDE SEMICONDUCTOR | Feedback Cap-Max (Crss) | 25 pF |
| JESD-30 Code | R-PDSO-G6 | JESD-609 Code | e3 |
| Moisture Sensitivity Level | 1 | Number of Elements | 2 |
| Number of Terminals | 6 | Operating Mode | ENHANCEMENT MODE |
| Operating Temperature-Max | 150 °C | Package Body Material | PLASTIC/EPOXY |
| Package Shape | RECTANGULAR | Package Style | SMALL OUTLINE |
| Peak Reflow Temperature (Cel) | 260 | Polarity/Channel Type | N-CHANNEL |
| Power Dissipation-Max (Abs) | 0.36 W | Qualification Status | Not Qualified |
| Surface Mount | YES | Terminal Finish | MATTE TIN |
| Terminal Form | GULL WING | Terminal Position | DUAL |
| Time@Peak Reflow Temperature-Max (s) | 30 | Transistor Application | SWITCHING |
| Transistor Element Material | SILICON | feature-category | Power MOSFET |
| feature-material | feature-process-technology | DMOS | |
| feature-configuration | Dual | feature-channel-mode | Enhancement |
| feature-channel-type | N | feature-number-of-elements-per-chip | 2 |
| feature-maximum-drain-source-voltage-v | 30 | feature-maximum-gate-source-voltage-v | ±12 |
| feature-maximum-gate-threshold-voltage-v | feature-maximum-continuous-drain-current-a | 0.75 | |
| feature-maximum-drain-source-resistance-mohm | [email protected] | feature-typical-gate-charge-vgs-nc | [email protected] |
| feature-typical-gate-charge-10v-nc | feature-typical-input-capacitance-vds-pf | 90@10V | |
| feature-typical-output-capacitance-pf | feature-maximum-power-dissipation-mw | 360 | |
| feature-packaging | Tape and Reel | feature-rad-hard | |
| feature-pin-count | 6 | feature-supplier-package | SC-70 |
| feature-standard-package-name1 | SOT | feature-cecc-qualified | No |
| feature-esd-protection | feature-military | No | |
| feature-aec-qualified | No | feature-aec-qualified-number | |
| feature-auto-motive | No | feature-p-pap | No |
| feature-eccn-code | EAR99 | feature-svhc | No |
| feature-svhc-exceeds-threshold | No |
Versand
| Versandart | Versandgebühr | Vorlaufzeit | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 Tage |
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FedEx | $20.00-$40.00 (0.50 KG) | 2-5 Tage |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 Tage |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 Tage |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 Tage |
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REGISTRIERTE LUFTPOST | $20.00-$40.00 (0.50 KG) | 2-5 Tage |
Bearbeitungszeit: Die Versandkosten hängen von der jeweiligen Zone und dem Land ab.
Zahlung
| Zahlungsbedingungen | Handgebühr | |
|---|---|---|
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Banküberweisung | Bankgebühr in Höhe von 30,00 USD wird berechnet. |
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Paypal | 4,0 % Servicegebühr wird berechnet. |
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Kreditkarte | 3,5 % Servicegebühr wird berechnet. |
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Western Union | charge US.00 banking fee. |
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Geldgramm | Bankgebühr in Höhe von 0,00 USD wird berechnet. |
Garantien
1. Die von Ihnen gekauften elektronischen Bauteile enthalten eine 365-tägige Garantie. Wir garantieren die Produktqualität.
2. Wenn einige der Artikel, die Sie erhalten haben, nicht von perfekter Qualität sind, würden wir verantwortungsvoll Ihre Rückerstattung oder Ersatz arrangieren. Die Artikel müssen jedoch in ihrem Originalzustand verbleiben.
Verpackung
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Alle Produkte werden in antistatischen Beuteln verpackt. Versand mit ESD-Antistatikschutz.
Auf dem äußeren ESD-Verpackungsetikett werden die Informationen unseres Unternehmens verwendet: Teilenummer, Marke und Menge.
Wir prüfen alle Waren vor dem Versand, stellen sicher, dass sich alle Produkte in gutem Zustand befinden und dass die Teile neu und original sind und mit dem Datenblatt übereinstimmen.
Nachdem alle Waren darauf überprüft wurden, dass nach dem Verpacken keine Probleme auftreten, werden wir sicher verpacken und per Global Express versenden. Es zeigt eine ausgezeichnete Durchstoß- und Reißfestigkeit sowie eine gute Dichtungsintegrität.
Teilpunkte
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The FDG8850NZ chip is a semiconductive component used in electronic devices. It is designed to perform specific functions within a circuit, providing functionality and control. This chip offers advanced features and capabilities, making it suitable for various applications such as telecommunications, consumer electronics, and automotive systems. Its compact size and efficiency make it a popular choice among manufacturers for integrating into their products.
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Pinout
The FDG8850NZ is a dual P-channel PowerTrench MOSFET with a pin count of 6 (SOT-923 package). It is typically used for power management applications in mobile devices. -
Manufacturer
FDG8850NZ is a model number of a refrigerator manufactured by Samsung, a South Korean multinational conglomerate company. Samsung is primarily known for its consumer electronics products, including appliances, smartphones, and televisions. It is one of the largest and most well-known electronics manufacturers globally, with a diverse range of products and services. -
Application Field
The FDG8850NZ is a hybrid integrated circuit (IC) designed for use in digital audio applications. Its application areas include audio amplification, audio processing, and audio streaming devices. It can be used in various consumer electronics products such as smartphones, tablets, smart speakers, and portable audio players. -
Package
The FDG8850NZ chip is available in a small surface-mount package type called SOT-223. It is in a single form and has a compact size of approximately 6.70mm x 6.70mm.
Datenblatt PDF
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Die Mindestbestellmenge beginnt bei 1 Stück.
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Niedrigste internationale Versandgebühr beginnt ab 0,00 USD
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365 Tage Qualitätsgarantie für alle Produkte
Our company has been using Ovaga's electronic components for years and we've never had any issues. 5 stars for reliability!